Cools to Present Glass Substrate Packaging Technology at Fly Asia 2026 Global Demo Day

Cools (쿨스), a company working on thermal control technology for advanced semiconductor packaging, will present its glass substrate packaging technology at G-VENSDAY, a global demo day to be held on October 8 at Exhibition Hall 1 of BEXCO in Busan. The company is led by chief executive Cho Jin-hyun.

G-VENSDAY is a side programme of Fly Asia 2026, an Asian startup expo. It is hosted by Series Ventures and the Busan Metropolitan Government and organised by the Korea Early Stage Accelerator Association and the Busan Technology Startup Investment Agency. The programme is open to companies preparing to expand abroad from among those incubated by KDB NextONE Busan, a startup support programme run by the Korea Development Bank, and by Series Ventures. Cools was selected for the fifth cohort of KDB NextONE Busan in July.

The event runs from 10 a.m. to noon on October 8. The first session, an investor relations demo day for companies targeting overseas markets, will feature about 10 companies, each given five minutes to present and five minutes for questions. Pitches and questions will be in English, with venture capital firms and investment institutions from Asia and elsewhere taking part. The second session consists of one-on-one meetings between the participating companies and investors.

Cools will use its pitch to introduce its work in glass substrate packaging. Glass substrates offer greater flatness and dimensional stability than silicon and are being examined as a material for next-generation interposers, but a problem remains: as the aspect ratio of through-glass vias (TGV) increases, it becomes harder to maintain interface continuity during metallisation. The burden of controlling warpage in the bonding process also grows as package area increases. Cools is developing a metallisation process that secures uniform plating inside the vias, along with low-warpage bonding technology for large-area glass interposers.

"The current competition in advanced packaging is a battle for technological supremacy on a scale comparable to wartime," Cho said. "Who first solves the mass-production bottlenecks in via metallisation and bonding, and who first secures those solutions as patents, will determine not only next-generation packaging but supremacy in the AI industry as well."

He added: "Cools will use process innovation and core patents to bring glass substrates to commercial use sooner, and will take the lead in this competition through global investment and strategic partnerships."

Cools was founded in April 2026 in Changwon, South Gyeongsang Province, and works on semiconductor bonding, heat dissipation and interface thermal control. Its main technology, Thermal Clutch, changes the cooling method used in thermal compression bonding for high-bandwidth memory from air-jet convection to direct solid-contact conduction. The company's business lines are cooling module supply, joint equipment development and intellectual property licensing.